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PC IUPILON™  H-2000R MITSUBISHI THAILAND

653
  • Properties:
    High mobility
  • Usages:
    Electrical field
    Electronic field
    Automotive sector
    Medical packaging
  • Certificates:
    UL
    UL

Technical Data Sheet

physical property Test ConditionTest MethodTest ResultUnit
Melt mass flow rate300°C/1.2kgISO113322g/10min
Melt volume flow rate300°C/1.2kgISO113320.0cm3/10min
Shrinkage rateTD:3.20mm0.50to0.70%
Shrinkage rateMD:3.20mm0.50to0.70%
Shrinkage rate吸水率(饱和,23°C)0.24%
Mechanical performanceTest ConditionTest MethodTest ResultUnit
Tensile modulusISO527-22400Mpa
Tensile stress屈服ISO527-262.0Mpa
Tensile strain屈服ISO527-26.6%
Nominal tensile fracture strainISO527-2120%
Bending modulusISO1782300Mpa
Bending stressISO17893.0Mpa
Thermal performanceTest ConditionTest MethodTest ResultUnit
Hot deformation temperature0.45MPa,未退火ISO75-2/B138°C
Hot deformation temperature1.8MPa,未退火ISO75-2/A124°C
Linear coefficient of thermal expansionMDISO11359-26.5E-05cm/cm/°C
Linear coefficient of thermal expansionTDISO11359-26.6E-05cm/cm/°C
Electrical performanceTest ConditionTest MethodTest ResultUnit
Surface resistivityIEC600936E+15ohms
Volume resistivityIEC600933E+16ohms·cm
Dielectric strength1.00mmIEC60243-131KV/mm
Dielectric strength3.00mmIEC60243-118KV/mm
Relative permittivity100HzIEC602503.10
Relative permittivity1MHzIEC602503.10
Dissipation factor100HzIEC602506E-04
Dissipation factor1MHzIEC602509E-03
Compared to the anti leakage trace indexCTIUL746PLC2
Impact performanceTest ConditionTest MethodTest ResultUnit
Impact strength of simply supported beam without notch23°CISO179NoBreak
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.