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FEP TEFLON®  5100 DUPONT USA

653
  • Properties:
    Thermal stability
    High temperature resistan
    High mobility
    Excellent toughness/compo
    Heavy packaging bags
  • Usages:
    Electronic and electrical
    Automotive components

Technical Data Sheet

physical property Test ConditionTest MethodTest ResultUnit
Melt indexASTM D12380.85g/10min
film thickness 25μm
Mechanical performanceTest ConditionTest MethodTest ResultUnit
Dart impactASTM D1709540Ag
Elmendorf tear strengthMD/CDASTM D1922260/670g
Yield tensile strengthMD/CDASTM D88211.9/12.4Mpa
Tensile strength at breakMD/CDASTM D88243.6/36.0Mpa
Elongation rateMD/CDASTM D882480/620%
2% secant modulusMD/CDASTM D882231/256Mpa
puncture resistance 陶氏方法28.3J/cm³
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.