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AS(SAN) POLYLAC®  D-178L200 ZHENJIANG CHIMEI

511
  • Properties:
    enhance
    transparent
  • Usages:
    chip
    container
  • Certificates:
    UL
    MSDS

Technical Data Sheet

physical property Test ConditionTest MethodTest ResultUnit
Melt index200℃ 5kgASTM D-12382.5g/10min
Shrinkage rate23℃(73℉)ASTM D-9550.2-0.5%
Mechanical performanceTest ConditionTest MethodTest ResultUnit
tensile strength 23℃(73℉)ASTM D-638700kg/cm
Rockwell hardness23℃(73℉)ASTM D-78580M
Bending modulus23℃(73℉)ASTM D-79035000kg/cm
bending strength 23℃(73℉)ASTM D-7901000kg/cm
IZOD impact strength1/4〃(6.35mm) 23℃(73℉)ASTM D-2561.4kg.cm/cm
Thermal performanceTest ConditionTest MethodTest ResultUnit
Hot deformation temperature18.6kg/cmASTM D-64894(201)℃(℉)
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.