Shrinkage rate

TD

%

--

1

Shrinkage rate

MD

%

--

0

Tensile modulus

MPa

11300

1

Tensile strain

断裂

%

1.9

2

Bending modulus

MPa

10800

9

RTIElec

0.400mm

°C

--

1

RTIElec

0.750mm

°C

--

1

RTIElec

1.50mm

°C

--

1

RTIElec

3.00mm

°C

--

1

Hot deformation temperature

1.8MPa,未退火

°C

--

2

Melting temperature 1

°C

--

3

Linear coefficient of thermal expansion

MD

cm/cm/°C

--

1

Linear coefficient of thermal expansion

MD:-40到23°C

cm/cm/°C

--

1

Linear coefficient of thermal expansion

MD:55到160°C

cm/cm/°C

--

1

Linear coefficient of thermal expansion

TD

cm/cm/°C

--

6

Linear coefficient of thermal expansion

TD:-40到23°C

cm/cm/°C

--

6

Linear coefficient of thermal expansion

TD:55到160°C

cm/cm/°C

--

9

Leakage Trace Index

V

--

6

Extreme Oxygen Index

%

--

3

Hot filament ignition temperature

0.400mm

°C

--

7

Hot filament ignition temperature

3.00mm

°C

--

7

Burning wire flammability index

0.400mm

°C

--

9

Burning wire flammability index

3.00mm

°C

--

9