Material Comparison
Product Info
Product Name
Brand Name
Usages
Properties
Certificates
PC LV-2250Y BK TEIJIN JAPAN
PANLITE®
Electrical field、Electronic field
transparent
UL
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Plastic Datasheets
Physical properties
Test Condition
Test Method
Unit
PC/TEIJIN JAPAN/LV-2250Y BK
Molding shrinkage rate
ASTM D955
%
0
Water absorption rate 23 ℃/24h
ASTM D570/ISO 62
%
0
Mechanical performance
Test Condition
Test Method
Unit
PC/TEIJIN JAPAN/LV-2250Y BK
elongation at break
ASTM D638/ISO 527
%
1
Tensile modulus
ASTM D638/ISO 527
kg/cm²(MPa)[Lb/in²]
2
Bending modulus
ASTM D790/ISO 178
kg/cm²(MPa)[Lb/in²]
2
bending strength
ASTM D790/ISO 178
kg/cm²(MPa)[Lb/in²]
9
Tensile elongation at break (elongation at break)
ASTM D638/ISO 527
%
5
Thermal performance
Test Condition
Test Method
Unit
PC/TEIJIN JAPAN/LV-2250Y BK
Hot deformation temperature
ASTM D648/ISO 75
℃（℉）
2
vicat softening point
ASTM D1525/ISO R306
℃（℉）
3