SpiralFlow3.4

内部方法

CM

1

Shrinkage rate 5

TD

ISO294-4

%

1

Shrinkage rate 5

MD

ISO294-4

%

1

Tensile modulus

23°C

ISO527-2

Mpa

3

Tensile strain

断裂,23°C

ISO527-2

%

2

Tensile stress

屈服,23°C

ISO527-2

Mpa

7

Bending modulus

23°C

ISO178

Mpa

3

Bending stress

23°C6

ISO178

Mpa

1

Bending stress

3.5%应变,23°C

ISO178

Mpa

1

Bending stress

125°C

ISO178

Mpa

7

Bending stress

175°C

ISO178

Mpa

1

Bending stress

275°C

ISO178

Mpa

1

Compressive stress

23°C

ISO604

Mpa

1

Compressive stress

120°C

ISO604

Mpa

6

Glass transition temperature

--7

ISO11357-2

°C

1

Glass transition temperature

--8

ISO11357-2

°C

1

Hot deformation temperature

1.8MPa,未退火

ISO75-2/Af

°C

1

Melting temperature

ISO11357-3

°C

3

Linear coefficient of thermal expansion

MD:<143°C

ISO11359-2

cm/cm/°C

4

Linear coefficient of thermal expansion

MD:>143°C

ISO11359-2

cm/cm/°C

1

Linear coefficient of thermal expansion

TD:<143°C

ISO11359-2

cm/cm/°C

6

Linear coefficient of thermal expansion

TD:>143°C

ISO11359-2

cm/cm/°C

1

Dielectric strength

2.00mm

IEC60243-1

KV/mm

2

Leakage Trace Index

IEC60112

V

1

Volume resistivity

23°C

IEC60093

ohms·cm

1

Melt viscosity

400°C

ISO11443

Pa·s

3