Material Comparison
Product Info
Product Name
Brand Name
Usages
Properties
Certificates
PC LDS 3764/23715 MITSUBISHI ENGINEERING JAPAN
IUPILON™
Laser beacon、Laser direct molding、Phone
High mobility
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Plastic Datasheets
physical property
Test Condition
Test Method
Unit
PC/MITSUBISHI ENGINEERING JAPAN/LDS 3764/23715
Melt volume flow rate
260°C/5.0kg
ISO1133
cm3/10min
2
Shrinkage rate
MD
ISO294-4
%
0
Water absorption rate
平衡,23°C,50%RH
ISO62
%
0
Mechanical performance
Test Condition
Test Method
Unit
PC/MITSUBISHI ENGINEERING JAPAN/LDS 3764/23715
Nominal tensile fracture strain
ISO527-2
%
>
Tensile modulus
ISO527-2
Mpa
2
Tensile strain
屈服
ISO527-2
%
5
Tensile stress
屈服
ISO527-2
Mpa
6
Bending modulus
ISO178
Mpa
2
Bending stress
ISO178
Mpa
9
Thermal performance
Test Condition
Test Method
Unit
PC/MITSUBISHI ENGINEERING JAPAN/LDS 3764/23715
Hot deformation temperature
1.8MPa,未退火
ISO75-2/A
°C
1
Vicat softening temperature
ISO306/B50
°C
1
Electrical performance
Test Condition
Test Method
Unit
PC/MITSUBISHI ENGINEERING JAPAN/LDS 3764/23715
Surface resistivity
IEC60093
ohms
>
Volume resistivity
IEC60093
ohms·cm
>