Dissolving fingers

300℃

ISO 1133

cm310min

2

Melt volume flow rate

300°C/1.2kg

ISO1133

cm3/10min

2

Shrinkage rate

TD:4.00mm

内部方法

%

0

Shrinkage rate

MD:4.00mm

内部方法

%

0

Water absorption rate

23°C,24hr

ISO62

%

0

Nominal tensile fracture strain

ISO527-2/50

%

2

Tensile strength at break

50mm/min

ISO 527-1

Mpa

5

elongation at break

50mm/min

ISO 527-1

%

2

Tensile modulus

ISO527-2/1

Mpa

2

Tensile strain

屈服

ISO527-2/50

%

6

Tensile stress

屈服

ISO527-2/50

Mpa

6

Tensile stress

断裂

ISO527-2/50

Mpa

5

Yield tensile strength

50mm/min

ISO 527-1,2

Mpa

6

Gap impact strength

Notched

ISO 179

kJ/m²

9

Bending modulus

2mm/min

ISO 178

Mpa

2

Bending modulus 3

ISO178

Mpa

2

bending strength

2mm/min

ISO 178

Mpa

9

Bending stress 3

ISO178

Mpa

9

RTI

1.5mm

UL746

°C

1

RTIElec

1.5mm

UL746

°C

1

Evolution Calendar intelligent importer

1.5mm

UL746

°C

1

Hot deformation temperature

1.8MPa,未退火

ISO75-2/A

°C

1

Hot deformation temperature

1.80MPa

ISO 75-1,2

°C

1

Linear coefficient of thermal expansion

MD

ISO11359-2

cm/cm/°C

7

Linear coefficient of thermal expansion

TD

ISO11359-2

cm/cm/°C

7

Surface resistivity

IEC60093

ohms

>

Volume resistivity

IEC60093

ohms·cm

>

Hot filament ignition temperature

1.5mm

IEC60695-2-13

°C

8

Hot filament ignition temperature

3.0mm

IEC60695-2-13

°C

8

Burning wire flammability index

1.5mm

IEC60695-2-12

°C

9

Burning wire flammability index

3.0mm

IEC60695-2-12

°C

9

Dispersion degree

2.0mmt

In-house method

%

1

Light transmittance

1.5mmt

JIS K7136

%

8

transmissivity

3000µm

ASTMD1003

%

7